Chipbond, The Taiwanese manufacturer chosen by Apple for some of the next device components. According to some reports Chipbond can leverage NFC ( Near Filed Communication ) and fingerprint recognition components for next gen iPhone.
Apple is expected to use these two technologies to make safe combination for mobile payments. This would be the first of its kind components that would be available in a smartphone.
Packaging and testing giant Chipbond Science and Technology (6147) Will this year be the big mouth to bite! Apple’s next-generation iPhone 5S Will Be the first to import the built-in the touch IC core integrated touch display driver IC (TDDI), and for the first time to support wireless near field communication (NFC) fingerprint Chipbond exclusive to win TDDI seal Measured, NFC sense of Fingerprint Sensor IC gold bumps large orders.
Fingerprint reading sensor may work with iPhone 5S touchscreen, according to this rumour, but U.S. analysts say that it falls below the Home button. Yet no one knows for sure how this component will be implemented in iPhone 5S, but now seems pretty clear that Apple is testing prototypes that implemented a fingerprint reader.
Via | MacRumors